| 摘要 |
<p>An ultrahigh molecular weight polyethylene (UHMWPE) composite (12) for use in printed circuit board or antenna base material. A base material includes at least one dielectric layer which comprises of an ultrahigh molecular weight polyethylene composite (12) and at least one electroconductive layer (16) which comprises of an electroconductive material; the dielectric and electroconductive layers being intimately bonded to one another.</p> |
