发明名称 BOILING AND COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a boiling and cooling device, with which the interference between the part on the circumference of a chip and a refrigerant bath, and a satisfactory refrigerant circulation stream can be formed. SOLUTION: A refrigerant bath 4 is constituted of a thin type container 6 and a cover part 7. The thin-type container 6 has a planar shape of almost trapezoidal form, a heat-receiving surface which comes in contact with a chip 3 is provided on one side in the thickness direction, and a boiling space, a set of header connection part 1, a vapor path and a liquid retaining path are provided on the other side. The heat-raceiving surface is formed in a size in matching with the shape of the chip 3 in almost a square shape and the heat- receiving surface protrucing from the other parts. The vapor path is a path which guides the boiler refrigerant vapor to a heat dischargge part 5 in the boiled space, and the vapor path is connected to the boiling space in a wide range from the upper side to the right side of the boiled space. The liquid return path is a path where the liquefied condensed liquid, which is liquefied in the heat-discharging part 5 is returned to the boiling space, and it is communicated to the left side lower part of the boiling space from the heater connection part.
申请公布号 JP2000183259(A) 申请公布日期 2000.06.30
申请号 JP19980359958 申请日期 1998.12.18
申请人 DENSO CORP 发明人 TERAO MASAYOSHI;TANAKA KOJI;KAWAGUCHI SEIJI;OOHARA TAKAHIDE;MAEDA AKIHIRO
分类号 H05K7/20;F25D9/00;F28D15/02;H01L23/427 主分类号 H05K7/20
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