发明名称 MOLD FOR MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To improve a quality of a resin molding by making a temperature of a mold body uniform. SOLUTION: Sintered metal layers 34A to 34F are constituted in thickness so as to be small at a supply side of a heating medium (water inlets 36A to 36F side) and large at a discharge side (drain ports 37A to 37F side), and when a site between the layers 34A to 34F of the body 31 and a cavity 50 is a cavity mold (bottoms 39A to 39F of channels), the bottoms 39A to 39F of the channels are constituted to be in thickness large at water input ports 36A to 36F side and small at drain ports 37A to 37F side.
申请公布号 JP2001347528(A) 申请公布日期 2001.12.18
申请号 JP20000172491 申请日期 2000.06.08
申请人 HONDA MOTOR CO LTD 发明人 KIMURA MIKIHIKO;UEHA FUMITO;TSUJI MASATERU
分类号 B29C33/04;B29C33/38;(IPC1-7):B29C33/04 主分类号 B29C33/04
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