| 摘要 |
The invention concerns a semiconductor package and its production method, wherein a semiconductor component (5) is fixed on a front surface of mounting and electrical connection means (2) and comprising a sensor (8), an insert (11) being supported on the front surface of said optical component, around said sensor and comprising an open passage (14) extending in front of said sensor, and encapsulating means (26) comprising a coating material which encloses said semiconductor component and the mounting and electrical connecting means, said passage comprising a cap (17). |
