| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize high quality for an interposer board and an electronic component body other than the miniaturization and narrow pitch of an electrode pad and connection land. SOLUTION: In an interposer board, the surface of a blind conduction body is used as an electrode pad or a land for connection, which is formed by forming plating layers on both end faces of a filler which is filled inside via holes piercing a printed wiring board, so as to be the same planarity as both surfaces of the printed wiring board.</p> |
