| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling device, by which a semiconductor element is cooled effectively, which prevents the generation of damage in the semiconductor element and which can enhance the performance of the semiconductor element. SOLUTION: The cooling device 1 is provided with a housing chamber 9, which is constituted inside a heat insulating box body 6 and which is used to house boards 3 with attached semiconductor elements, a refrigerant circuit which is installed inside the machine chamber 37 of a body 9 and which is constituted of a compressor 38, a condenser 39, a pressure-reducing device, a cooler 21 and the like and a blower 22 with which cool air heat-exchanged with the cooler is circulated inside the housing chamber. |
