| 摘要 |
PROBLEM TO BE SOLVED: To provide an interconnecting method for a multilayer printed circuit board capable of easily being handled and improving productivity by increasing the strength of a base material 50, wherein the loss of the material can be reduced by forming projecting connecting strips using a plating method. SOLUTION: The multilayer printed circuit board is manufactured by successively carrying out steps of forming a plurality of plating grooves respectively in a dry film after the dry film is formed on a first thin metal film 56 so that the first thin metal film 56 is selectively exposed, forming a plurality of projecting connecting strips 68 by forming a plated layer by plating on the surface of the first thin metal film 56 exposed by those plating groove, forming an insulating layer 70 on the first thin metal film 56 after removing the dry film, and forming a second thin metal film 76 on the surface of the insulating layer 70 so that it is connected to tip ends of the projecting connecting strips 68. COPYRIGHT: (C)2005,JPO&NCIPI |
