发明名称 |
Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
摘要 |
A semiconductor wafer includes a redistribution layer which is electrically connected with a pad which is an end portion of an interconnect, a first resin layer which is formed over the redistribution layer, a second resin layer which is formed over the first resin layer and covers the side surface of the first resin layer, and an external terminal which is formed to be electrically connected with the redistribution layer in a manner to avoid the pad.
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申请公布号 |
US2005040523(A1) |
申请公布日期 |
2005.02.24 |
申请号 |
US20030679467 |
申请日期 |
2003.10.07 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HANAOKA TERUNAO |
分类号 |
H01L23/12;H01L21/74;H01L23/31;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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