发明名称 |
Forming process of thin film pattern and manufacturing process of device, electro-optical apparatus and electronic apparatus |
摘要 |
The invention provides a forming process of a thin film pattern capable of properly realizing a thin line. The forming process of a thin film pattern of the invention can be a process of forming a thin film pattern by arranging a functional liquid on a substrate P. The process can include a bank forming step to set up banks protrudingly on the substrate corresponding to the thin film pattern, a repellent liquefaction step of imparting a liquid repellent property to the bank by CF<SUB>4 </SUB>plasma processing, and a material arranging step of arranging the functional liquid between the banks imparted with the liquid repellent property.
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申请公布号 |
US7326585(B2) |
申请公布日期 |
2008.02.05 |
申请号 |
US20040843426 |
申请日期 |
2004.05.12 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HIRAI TOSHIMITSU |
分类号 |
G02F1/13;H01L21/00;B05D1/26;B05D3/04;G02F1/1333;H01L21/02;H01L21/20;H01L21/208;H01L21/288;H01L21/3205;H01L21/768;H05K3/12 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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