| 摘要 |
An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concave is located on a surface of the substrate. The image signal processor is disposed in the concave, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concave. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.
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