| 摘要 |
FIELD: physics. ^ SUBSTANCE: module accommodates multilayer printed circuit board with N conducting planes and plated holes used to ensure interface electric connections, with high-frequency and low-frequency connectors, as well as printed wires and radio-frequency components grouped by three zones - analogue signal processing, digital power generation and digital signal processing. The first two are adjoins each other within the 1st to n-th conducting planes, while the third one is arranged thereunder occupying (n+1)-th to N-th conducting planes, where n>=6, N-n>=6. Each zone includes shielding earth planes and earth sites. Besides digital signal processing zone involves digital power sites and perimetritic shielding wires of barrier screen, while analogue signal processing contains analogue power wires. Digital power sites are connected to output pins of digital power voltage generators arranged in digital power generation zone. Common point of analogue power wires is connected to output pin of analogue power voltage generator arranged in analogue signal processing zone. Input pins of digital and analogue power voltage generators are electrically connected to output pin of input power filter provided in digital signal processing zone. Herewith the first of these connections is enabled by plated through hole, and the second one by related printed wire crossing zone interface of digital power generation and analogue signal processing. Shielding earth planes of digital signal processing zone are interconnected through plated blind holes, and connected to earth sites and shielding wires of barrier screen and coupled to Earth pin of low-frequency connector. Shielding earth planes of digital power generation zone are interconnected and connected to earth sites of the proper zone through plated blind holes, and to shielding earth planes of digital signal processing zone via plated through holes. Earth sites of analogue signal processing zone are connected to shielding earth plane in i-th conducting plane between the 1st and n-th conducting planes via plated blind holes, and connected to earth site of digital power generation zone by conductive bridge in the first conducting plane. Shielding earth plane of analogue signal processing zone in n-th conducting plane is connected to shielding earth plane of digital power generation zone arranged in the same conducting plane through printed bridge. ^ EFFECT: development of single-board design with analogue signal processing and digital power generation located on one side of multilayer printed-circuit board, and digital signal processing on the other side, and maintenance of onboard electromagnetic compatibility considering these requirements. ^ 2 cl, 17 dwg |
