| 摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Cr-Si-based rolled copper alloy foil which is preferably used in an electromagnetic-wave shielding material. SOLUTION: The high conductivity Cu-Cr-Si-based alloy foil for electrical or electronic parts is a copper alloy foil which comprises, by mass%, 0.15 to 0.50% Cr, 0.02 to 0.15% Si and the balance Cu with unavoidable impurities, while controlling a mass ratio Cr/Si of the additive quantities of Cr and Si to 3.5 to 8.0; and has precipitates with an average particle size of 10 to 100 nm existing in a copper matrix phase. The copper alloy foil includes Cr carbides with diameters of 0.5 to 2.0μm in an amount of 10 pieces/mm<SP>2</SP>, and the carbides of 2.0μm or more in the amount of 0 piece/mm<SP>2</SP>; has a thickness (t) of 6 to 10μm; has a ratio (Ry/t) of a maximum height (Ry) of the foil surface to the thickness (t) in an amount of 0.2 or less; and contains recrystallized grains with an average grain size smaller than 10μm. The manufacturing method therefor includes forming the precipitates and the recrystallized structure by annealing the foil at 200 to 600°C by a temperature of the copper foil for 0.1 to 180 minutes after having finished final rolling. COPYRIGHT: (C)2009,JPO&INPIT
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