发明名称 PRINTED-CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a printed-circuit board capable of reducing in a size of an EBG structure which can prevent a high frequency noise generated in the other digital circuit from being mixed into an analog circuit and electromagnetic interference generated at an external device from being flowed out in a mixed circuit of a digital circuit and the analog circuit and which has a power supply layer having such a structure, and a manufacturing method thereof.SOLUTION: In a printed-circuit board in which a power supply path is arranged onto an insulation layer between a digital circuit 2 and an analog circuit 3, one of the printed-circuit board is connected to the power supply path, the other is an open stub in an opening state, and an open stub EBG structure 4 in a plurality of the open stub states is arranged to an edge of a bridge part of a power source plane.SELECTED DRAWING: Figure 2
申请公布号 JP2016111314(A) 申请公布日期 2016.06.20
申请号 JP20150039026 申请日期 2015.02.27
申请人 OKAYAMA UNIV;KYOCERA CIRCUIT SOLUTIONS INC;NEC TOKIN CORP 发明人 TOYODA HIROTAKA;IOKIBE KENGO;YAMASHITA YUKI;KANEKO TOSHIYUKI;NAITO MASANORI;KAIYA KIYOHIKO;UEHARA TOSHIHISA;KONDO KOICHI
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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