| 摘要 |
The present invention relates to a flexible conductive substrate, and more specifically, to a flexible conductive substrate comprising: a conductive pattern layer formed on a release layer; an organic insulation layer formed on the release layer having the conductive pattern layer formed thereon; an adhesive layer formed on the organic insulation layer; and a base film formed on the adhesive layer. Since the adhesive layer satisfies a change rate of a relaxation modulus of 70 to 90% in an early hardening stage and one hour after hardening at room temperature (25°C), the durability of the flexible substrate is remarkably improved, so a crack is not generated even in deformation due to an external force such as bending, etc., and delamination is not generated in each layer. |
