| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing composition which can get superior characteristics in all of surface roughness of a wafer, shape of wafer and surface smoothness in the penumbra of the wafer without reducing grind speed in the grind of the semiconductor wafer.SOLUTION: A polishing composition contains a polyvinyl alcohol-based water-soluble polymer compound and a piperazine compound. The polishing composition preferably contains abrasive grains.SELECTED DRAWING: None |
