Semiconductor package structure and manufacturing method thereof

摘要

A semiconductor package structure includes a first semiconductor substrate including a conductive pad; and a conductive pillar on the conductive pad and disposed between the first semiconductor substrate and a second semiconductor substrate. The conductive pad is coupled with a circuitry of the first semiconductor substrate. The conductive pillar extends along a longitudinal axis and toward the second semiconductor substrate. The conductive pillar includes a sidewall with a rough surface notching toward the longitudinal axis.

主权项

1. A semiconductor package structure, comprising:
a first semiconductor substrate comprising a conductive pad, the conductive pad comprises a plurality of recesses, wherein the conductive pad is coupled with a circuitry of the first semiconductor substrate; a conductive pillar on the conductive pad and disposed between the first semiconductor substrate and a second semiconductor substrate, wherein the conductive pillar: extends along a longitudinal axis and toward the second semiconductor substrate, and includes a sidewall with a rough surface notching toward the longitudinal axis, and wherein the rough surface comprises a width greater than about 2 μm, and wherein a bottom surface of the conductive pillar interfaces with the plurality of recesses of the conductive pad.