POLISHING APPARATUS, POLISHING METHOD, AND SEMICONDUCTOR MANUFACTURING METHOD

摘要

A polishing apparatus includes a polisher, a holder, and a supplier. The polisher polishes a semiconductor substrate or a polishing target film on a semiconductor substrate. The holder holds the semiconductor substrate and presses the semiconductor substrate or the polishing target film against the polisher to rub the semiconductor substrate or the polishing target film against the polisher. The supplier has a nozzle that is to be inserted to the inside of the polisher and that supplies a polishing solution to the inside of the polisher.

主权项

1. A polishing apparatus comprising:
a polisher polishing a semiconductor substrate or a polishing target film on a semiconductor substrate; a holder holding the semiconductor substrate and pressing the semiconductor substrate or the polishing target film against the polisher to rub the semiconductor substrate or the polishing target film against the polisher; and a supplier having a nozzle that is to be inserted to inside of the polisher and that supplies a polishing solution to the inside of the polisher.