| 摘要 |
PURPOSE: To prevent generating of exfoliation of the interface of a die pad and to prevent generation of cracks by a method wherein the electrode group of a semiconductor chip and the first lead group are electrically connected, and the positional deviation in vertical and horizontal directions of the semiconductor chip is prevented by the third lead group. CONSTITUTION: The electrode 2 group of a semiconductor chip 1 and the inner lead 4 of the first lead group are electrically connected through the metal fine wires 3 which are extended to the circumference of the semiconductor chip 1 or to the vicinity of the electrodes 2. Dummy leads 5, which are the second lead group, are arranged on the opposite side of the semiconductor chip 1, and the positional deviation in vertical direction of the semiconductor chip 1 is prevented. Also, dummy leads 6, which are the third lead group, are arranged along the side face of the two opposing sides of the semiconductor chip 1, and the positional deviation in horizontal direction of the semiconductor chip l is prevented. As a result, the generation of a leak current between the inner leads 4 can be prevented. |
