| 摘要 |
1291165 Electric couplings DIACON Inc 9 Dec 1970 [2 Jan 1970] 58469/70 Heading H2E [Also in Division H1] A package for a semi-conductor device comprises a pair of apertured dielectric layers 10, 12 with a patterned conductive foil 20 therebetween, aligned with the apertures 14, external connection being made to the foil via the apertures by conductive leads puncturing the foil. A semi-conductor wafer 40 having contact areas 46 may be placed in contact with portions of the foil 22, which constitute thin strips; and bonded by soldering, ultrasonic or thermal-compression bonding. The wafer may be mounted on a support 42 with a heat sink 44. The conductive leads may include pointed ends, which may be mounted on a circuit board, the package being placed over the leads so that the ends make contact with the foil via apertures 14. The lead ends may be bonded to the foil, again by soldering. The dielectric layers may be of alumina ceramic, the foil of an aluminium coated cobalt-iron-nickel alloy; or a copper-iron-nickel alloy. The conductive leads may be of brass, stainless steel or copper. The foil may be patterned by photoresist and etching methods. In an alternative embodiment, a plurality of dielectric layers with wafers may be stacked one upon another with aligned apertures, connection being made between the foils by leads having pointed ends. |
