PACKAGE FOR TAPE CARRIER SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: To provide a package for tape carrier semiconductor device which achieves with good yield device manufacturing process without any mixture of non-conforming articles. CONSTITUTION: A chip-mounting part 32 and a wiring pattern 34 are formed on a rigid panel made of resin. Only conforming unit wiring boards 30 of the unit wiring boards 30 which are cut into individual pieces are aligned in a row with a specific pitch, both edge parts are connected by a heat-resistance tape 37 via an adhesive, and a positioning hole 40 is opened to the tape 37 at a specific pitch.