| 摘要 |
PURPOSE:To remove a superfluous solder and to enable to mount a non-defective chip by a method wherein a glass chip having an Au film formed on the surface is brought into contact with the side of the substrate through the superfluous solder and a flux and after the solder is melted by heating, the glass chip is alienated. CONSTITUTION:Each IC chip 2 is mounted on a ceramic wiring substrate 1 through a connecting pattern 3 and a solder 4 being formed into a flip chip and a defective chip 5 is also mounted in the same manner. At the time of repair, the defective chip 5 is set on a hot press 7 provided with a glass tube being held in the upper direction thereof, heating gas 8 is fed and when the solder 4 is melted, the defective IC chip 5 is removed using a pincette 9. A glass chip 12 having an Au film 11 formed on the surface is set on a superfluous solder 10 being left on the connecting pattern 3 of the ceramic wiring substrate 1 through a flux 13. After the superfluous solder 10 is removed by heating, a non-defective IC chip 2 is anew re-mounted. |
