| 摘要 |
PURPOSE:To simplify the process of manufacture of the titled solder bump by a method wherein, after a solution containing a prescribed compound has been contacted to the electrode part exposed from an insulating film which will be coated on a substrate, fused solder is contacted to the electrode part, the solder is adhered by applying ultrasonic waves, and a base metal to be provided on the electrode in unnecessitated. CONSTITUTION:An electrode is exposed from the insulating film which is coated on a substrate, and the electrode part is dipped in the solution containing at least a kind of material selected from nitric acid, hydrochloric acid, phosphoric acid, oleic acid, palmitic acid, stearic acid, butyric acid, resin, sodium carbonate, borofluoric zinc, borofluoric cadmium and hydrazine. Said substrate 11 is dipped in the fused solder 23 of an ultrasonic soldering device, ultrasonic waves are applied to the solder 23 by an ultrasonic vibrator 25, and the solder is adhered by destroying the natural oxide film on the surface of the electrode.
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