| 摘要 |
PURPOSE:To simplify the process of manufacture of the titled solder bump by a method wherein fused solder is contacted to the electrode part exposed from the insulating film which will be coated on a substrate, and after a solder layer has been adhered by applying ultrasonic waves, the prescribed metal layer is formed thereon, and a solder bump of high height is formed without providing a base metal on the electrode. CONSTITUTION:The electrode part exposed from the insulating film, which will be coated on a substrate, is dipped in fused solder, ultrasonic waves are applied thereon, the solder is adhered by destroying the natural oxide film on the surface of the electrode. Then, the second metal layer is formed by contacting the fused metal having the melting point lower than that of the solder which is directly adhered to the electrode. A fused metal having the melting point lower than the above-mentioned metal is contacted successively as occasion demands. As a result, the solder bump of high height can be formed.
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