| 摘要 |
PURPOSE:To obtain a light emitting diode capable of light emission from its side surface by a method wherein, by using thermoplastic resin capable of being plated, a light emitting diode is arranged at the bottom of a recessed part of a printed wiring board vessel provided with solid wiring formed on a board vessel by plating, in which vessel the recessed part having an opening on the side surface is formed. CONSTITUTION:By using thermoplastic resin capable of being plated, metal wirings 10, 10' of an anode and a cathode are metal-plated and formed in the shaded region in figure of a board vessel 9 in which a recessed part having an opening on the side surface is formed. By using silver paste 4, a light emitting diode chip 3 is fixed on the metal wiring 10' of the left side of the bottom of the recessed part. An electrode of the surface of the light emitting diode chip 3 and the metal wiring 10 on the right side form an insulating region 11 in the figure are connected by a gold wire 5. In order to protect the light emitting diode chip 3 and to improve the leading-out efficiency of light, the recessed part is sealed by transparent resin 6. Thereby a side view type light emitting diode can be formed. |
