发明名称 PACKAGE MADE OF ALUMINUM NITRIDE
摘要 PURPOSE: To provide a package made of sintered aluminum-nitride with good mechanical strength, by preventing a crystal grain from enlarging without decreasing good thermal conductivity in sintered material. CONSTITUTION: A package is made of sintered aluminum-nitride material containing at least one of Ca, Sr or Ba oxide materials of 1 to 10wt.%, and silicon of 0.01 to 0.2wt.%. In addition to this way, only a surface layer of the package may be made of sintered aluminum-nitride material containing silicon. The inner layer contains at least one of Ca, Sr or Ba oxide materials of 1 to 10wt.%, and substantially no silicon material.
申请公布号 JPH0897321(A) 申请公布日期 1996.04.12
申请号 JP19940235577 申请日期 1994.09.29
申请人 TOSHIBA CORP 发明人 ASAI HIRONORI;KOMATSU MICHIYASU
分类号 H01L23/08;C04B35/581 主分类号 H01L23/08
代理机构 代理人
主权项
地址