发明名称 SURFACE MOUNTING SYSTEM BY CREAM SOLDER PRINTING
摘要 PURPOSE: To provide a surface mounting system by cream solder printing which can reduce the time during which a printed wiring board is left without parts to be mounted on the board after printing and can improve the quality of the wiring board. CONSTITUTION: A surface mounting system is provided with a cream solder printing machine 2 which prints cream solder on a wring board by applying the solder to the surface of the board, and a control section (CPU) 9 having a means which sends a cream solder printing start command, a means which calculates the command issuing timing, and a means which sends the command to the printing machine 2 in accordance with the timing.
申请公布号 JPH0897544(A) 申请公布日期 1996.04.12
申请号 JP19940254420 申请日期 1994.09.23
申请人 SONY CORP 发明人 SASAKI TAKAHIDE
分类号 H05K13/04;H05K3/12;H05K3/34 主分类号 H05K13/04
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