| 摘要 |
<p>PURPOSE:To provide a circuit board which improves close contact properties of polyimide when low thermal expansion polyimide is used as an interlayer insulating film in a multilayer circuit board of an electronic device, has high reliability and easily forms a multilayer fine interconnection pattern. CONSTITUTION:Since low thermal expansion polyimide has a linear rigid skeleton, close contact properties between completely cured low thermal expansion polyimide films is extremely low. On the other hand, since a polyimide film having a flexible skeleton exhibits high close contact properties even after the films are completely cured, the polyimide having the flexible skeleton is interposed between the low thermal expansion polyimide films to improve the close contact properties. After a flexible polyimide thin film 4 is formed as a high adhesive properties thin film on the low thermal expansion polyimide film 3 of a semicured state, metal interconnections 5 are provided, a high adhesive properties thin film 6 is again formed in a semicured state, and a low thermal expansion polyimide film 7 is formed thereon. A multilayer interconnection structure which improves adhesive properties of the low thermal expansion polyimide and a wiring pattern layer or a board, can be provided.</p> |
