PREPREG FOR BONDING AND SEMICONDUCTOR-MOUNTING MULTILAYER BOARD MADE THEREOF

摘要

PURPOSE:To provide a bonding prepreg composed of a specific resin varnish and glass cloth, having excellent embedding performance of inner-layer circuit and causing little entrainment of bubbles and flow-out of the resin and suitable for a multilayer board for mounting semiconductors. CONSTITUTION:The objective prepreg is composed of an opened glass cloth and an epoxy resin varnish having a gel time of 20+ or -10sec. The resin content of the prepreg is 55+ or -5%. One or two prepreg sheets are used as each bonding layer of a semiconductor-mounting multilayer board containing inner-layer circuit. The opening treatment of the glass cloth is preferably carried out by ejecting high-pressure water-jet of 30-150kg/cm<2> pressure.