发明名称 HIGH-FREQUENCY CIRCUIT BOARD
摘要 PURPOSE:To prevent the deterioration of transmitting characteristics due to the connecting part of a microstrip line when a high-frequency signal is transmitted using the micro-strip line. CONSTITUTION:When microstrip lines 3a and 3b are connected by bonding wire or gold ribbon 6, characteristic impedance of the connecting part of the bonding wire or the gold ribbon is matched by inserting high-dielectric constant rubber material 5. Therefore, high-frequency signal reflection generated at the connecting part is eliminated and the loss of the transmitting characteristics is prevented by matching the characteristic impedance of the bonding wire or the gold ribbon, which is provided between the connecting microstrip lines, with the impedance of the microstrip line.
申请公布号 JPH07130913(A) 申请公布日期 1995.05.19
申请号 JP19930276966 申请日期 1993.11.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 YAMADA KOJI;IKEDA YUKIO;MORITA NAOYA;TAKAHAMA TAKASHI;WATANABE NOBUO;SAKURAI YASUSHI
分类号 H01L23/12;H05K1/02;(IPC1-7):H01L23/12 主分类号 H01L23/12
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