| 摘要 |
PURPOSE:To put this device in such structure that the cooling efficiency is high and that the mounting is easy, concerning the mounting structure of a heat sink to the integrated circuit package mounted on a printed wiring board. CONSTITUTION:This is a structure to mount a heat sink 50 to the integrated circuit package 20 mounted on a printed wiring board 10, and here a guide member 30, which has a frame 30A and poles 30B, is fixed to the printed wiring board 10, and the heat sink 50 is seated on the inside periphery of the guide member 30 so that the heat sink 50 may stick fast to the integrated circuit package 20, and a cover 60 is fixed to the guide member 30 so as to cover the periphery of the top of the heat sink 50. |
