| 摘要 |
PURPOSE:To obtain a semiconductor integrated circuit having a high connection reliability and stable substrate potential which can apply the lead frame to any pellet with a general-purposed structure with no use of insulative films. CONSTITUTION:A lead frame where the size of an island 10 is smaller than that of any pellet 20 to be mounted and leads 13 of which are connected to the island 10 is used to cut off the island 10 from the leads 13 into a size matching the size for pellet 20 mounting so that all kinds of pellets 20 of different sizes to be mounted may be mounted with no use of insulators.
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