Component contact bonding reducing thermal stress on components during bonding

摘要

The appts. to bring wires of components and component groups into contact has an energy supply (5) additionally over the appts. to apply thermocompression or thermosonic bonding. At least one tilting mirror (2) is at the beam path from the energy supply (5) to deflect the beam (1) to contact path (3) of the component or component group. The energy supply (5) is a semiconductor laser module.