发明名称 MOUNTING DEVICE OF LEAD-ATTACHED COMPONENT
摘要 PURPOSE: To provide a lead-attached component mounting device which is capable of surely holding a lead-attached component and correcting bent leads. CONSTITUTION: The leads 4a of a lead-attached component 4 are held by a pair of collects 2 and 3 each having fingers 2c split by slits 2d1 or 2d2 , and the collets 2 and 3 are opened or closed by a collet holder 5. Therefore, a mounting device of this constitution is capable of surely holding the leads of a component and correcting the bent leads.
申请公布号 JPH08330795(A) 申请公布日期 1996.12.13
申请号 JP19950138145 申请日期 1995.06.05
申请人 SONY CORP 发明人 YOSHIDA YOSHIMICHI
分类号 B23P21/00;B25J15/08;H05K13/04 主分类号 B23P21/00
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