| 摘要 |
PURPOSE: To obtain a probe structure in which the pressure being applied to the entire probe can be reduced by facilitating the electrical connection at the time of contact test, especially the burn-in test, of an object having bump contacts regardless of fluctuation in the height of bump and suppressing the deformation of bump contact due to pressure contact thereby reducing the contact pressure on a bump contact requiring no connection. CONSTITUTION: A contact part 3 provided on one side of a flexible insulating film 1 is conducted with a circuit pattern 2 provided on any one side of the insulating film 1 in a planar probe structure. The contact part 3 is provided only at a position corresponding to a bump contact B1 requiring connection among objective bump contacts B and an opening 6, causing no deformation of bump contact at the time of inspection, is made in the insulating film 1 at the position corresponding to a bump contact B2 requiring no inspection. The contact part 3 is provided with an opening 4 in which the bump contact Bl is fitted to touch the contact part 3 annularly. |
