| 摘要 |
Cathode sputtering appts. for coating substantially flat substrates (11,11') comprises at least one evacuable forechamber (3), and at least one process chamber (4) joined to the forechamber, via an airlock system (13). There are several coating sources (8,9) per process chamber. The appts. further includes a substrate transport system (12,12'), and means for reversing the substrate transport direction.
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