| 摘要 |
An electronic component (12) is provided with a heat radiative ceramic plate (10) that is protected from cracks. The heat radiative plate (10) is bonded to the upper surface of the electronic component (12). The ceramic plate (10) is coated by a resin layer (16). The ceramic plate (10) is a 1mm to 2mm thick quadrangular plate prepared by sintering cordierite powder, which has a high emissivity of far-infrared rays. The resin layer (16) entirely or partly covers the surface of the ceramic plate, thereby preventing the plate from breaking and/or chipping and scattering ceramic powder to the surrounding area. |
