发明名称 Thin support for PC board transfer system
摘要 A transfer system that supports circuit boards as it conveys them through a reflow oven. The system uses a sag support between edge supports. The sag support does not have to move as the circuit board is transferred along the transfer system. The height of the sag support can be easily adjusted. The sag support's mounts can maintain appropriate tension in the sag support even if the sag support expands during operation. The system may use a mechanism to prevent the friction between the boards and the sag support from interfering with the movement of boards along the transfer system.
申请公布号 US5871325(A) 申请公布日期 1999.02.16
申请号 US19970934149 申请日期 1997.09.23
申请人 JABIL CIRCUIT, INC. 发明人 SCHMIDT, RONALD P.;VAN.EVERY, RICHARD J
分类号 F27B9/24;H05K13/00;(IPC1-7):F27B9/24 主分类号 F27B9/24
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