发明名称 |
LEAD FRAME ATTACHMENT FOR OPTOELECTRONIC DEVICE |
摘要 |
An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connectio n to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps and applying heat to melt the solder. |
申请公布号 |
CA2338993(A1) |
申请公布日期 |
2000.02.10 |
申请号 |
CA19992338993 |
申请日期 |
1999.06.23 |
申请人 |
BOOKHAM TECHNOLOGY PLC |
发明人 |
MAUND, BRIGG |
分类号 |
G02B6/42;G02B6/30;H01L23/02;H01L23/08;H01L23/48;H01L31/0232;H01L33/62;H01S5/022 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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