发明名称 COMPACT POST-MOLD COOLING DEVICE
摘要 The present invention relates to a multi-stage, post-mold cooling method and apparatus used in conjunction with an injection molding machine having an aggressive cycle time and a high output. The apparatus of the present invention includes a thermal conditioning device/station (36) with cooling tubes (62) for keeping separate the preforms (28) of each batch and effecting cooling of the molded preforms (28), several separated cooling levels (60) for simultaneously cooling multiple batches of preforms (28), and internal devices (64) for automatically transferring each batch of molded preforms (28) from one cooling level (60) to the next. In a preferred embodiment, the thermal conditioning device/station (36) is partially sealed to create a controlled temperature environment for conditioning the molded articles. In another embodiment, the thermal conditioning device/station (36) includes a level for re-heating the preforms (28).
申请公布号 WO0006356(A1) 申请公布日期 2000.02.10
申请号 WO1999US08636 申请日期 1999.04.20
申请人 HUSKY INJECTION MOLDING SYSTEMS INC.;NETER, WITOLD;OUESLATI, FAISAL;OLARU, GHEORGHE 发明人 NETER, WITOLD;OUESLATI, FAISAL;OLARU, GHEORGHE
分类号 B29C45/70;B29C35/16;B29C45/04;B29C45/72;B29C45/78;B29C49/06;B29C49/64;(IPC1-7):B29C31/08;B29C49/68 主分类号 B29C45/70
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