PROCESS AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES

摘要

A process and an apparatus for manufacturing semiconductor devices. The semiconductor devices comprise a carrier on which a die is mounted. During a stamping process a shaft is rotated and a plunger with a stamping tool are moved in the stamping direction in a reciprocating manner. When the stamping tool is lifted, a strip comprising semiconductor devices is moved such that a semiconductor device is positioned under the stamping tool. Subsequently the stamping tool is lowered whereby the leads are cut loose from the strip and are bent into an appropriate shape.