发明名称 FLAME-RETARDANT COMPOSITION FOR SOLDER RESIST, HARDENING METHOD AND USE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a flame-retardant composition having flame retardancy and flexibility both as well as being excellent in solder heat resistance, moisture proof, and reliability in a high temperature, which is therefore suitable for use as a cover lay film for an FPC, solder resist, etc. SOLUTION: This invention comprises following items: a flame-retardant composition including polyester resin (A) which contains a bromine atom in a molecule; a hardened material of the composition for solder resist; an ink containing the composition and a colorant; a hardening method of the composition; an insulating protection film and an interlayer insulating film composed of the composition; and printed circuit boards including the films. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005236273(A) 申请公布日期 2005.09.02
申请号 JP20050011351 申请日期 2005.01.19
申请人 SHOWA DENKO KK 发明人 KAMATA HIROTOSHI
分类号 H05K3/28;H05K3/46;(IPC1-7):H05K3/28 主分类号 H05K3/28
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