| 摘要 |
PROBLEM TO BE SOLVED: To enable flattening with less damage unrealizable with an existing monomer ion beam, by reducing an energy component perpendicular to a workpiece machining surface while using the feature of a gas cluster ion beam that can produce an order of magnitude higher sputtering rate than the monomer ion beam. SOLUTION: A gas cluster ion beam irradiation apparatus has an irradiation angle adjustment mechanism for adjusting an angle (irradiation angle) to a normal to a machining surface of a workpiece 15 at 50°to 90°, an ion acceleration mechanism for adjusting the kinetic energy of ions at a desired value, and a workpiece rotation mechanism for rotating the workpiece 15 on a rotation axis aligned with the normal to the workpiece machining surface. COPYRIGHT: (C)2006,JPO&NCIPI
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