| 摘要 |
This invention discloses a manufacturing method and the structure for a dissipation heat pipe. This dissipation heat pipe includes a hollow closed pipe, a type of fluid and a wick structure. The dissipation heat pipe is often used in conducting the heat from a chip. The dissipation heat pipe can be made of a special thermal conduction material, including the metal and a bracket structure of carbon element which have high thermal conductivity, so as to improve the heat conduction efficiency. The corresponding manufacturing method for this heat conduction material can be made by chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can coat on the metal surface and can also be mixed into the metal.
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