| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor devices which divides a semiconductor substrate into a plurality of semiconductor chips without carrying out dicing work and stably forms a high-quality protection film on the side surface of each semiconductor chip. SOLUTION: A corrosion-resistant supporting film (2) is glued to a main surface (1a) of a semiconductor substrate (1). Grooves (4) are formed on another main surface (1b) of the semiconductor substrate (1) in such a way that the grooves reach the opposite main surface (1a). An etching liquid is filled into the grooves (4) to form a recess surface on the side surface (3c) of each semiconductor chip (3). A heat-resistant adhesive film (5) is glued on another main surface (3b) of each semiconductor chip (3), and the supporting film (2) is removed from the main surface (3a) of each semiconductor chip (3). Then, a heat shrinking protection resin (6) is filled in the grooves (4) between semiconductor chips (3). By heating the protection resin (6), the resin is shrunk to form separating grooves (6a) in the protection resin (6) between neighboring semiconductor chips (3). The adhesive film (5) is removed from another main surface (3b) of each semiconductor chip (3), and the semiconductor chips (3) are separated along the separating grooves (6a). COPYRIGHT: (C)2008,JPO&INPIT
|
