| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in adhesion of an electrode and a substrate or an insulation layer, a method of easily manufacturing the semiconductor device, and a highly reliable electronic device. SOLUTION: The semiconductor device 1 is provided with an organic semiconductor layer 7, an insulation part 6, a gate part 3 overlapped with the organic semiconductor layer 7, a source part 4 positioned between the organic semiconductor layer 7 and the insulation part 6, and a drain part 5 positioned between the organic semiconductor layer 7 and the insulation part 6. The insulation part 6 includes a compound metal oxide constituted of a typical metallic element, and at least one of the source part 4 and the drain part 5 includes a part of the compound metal oxide constituting the insulation part 6, which is made into a conductor. COPYRIGHT: (C)2008,JPO&INPIT
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