发明名称 TRANSMISSION LINE MOUNTING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a transmission line mounting board having a transmission characteristic of low loss in a frequency band from DC (Direct Current) to GHz and having a prescribed delay characteristic. SOLUTION: High dielectric ratio resin layers 10 and 11 are formed so that they cover metallic conductors of the transmission lines (signal layers 3 and 4) formed on confronted faces of confronted dielectric substrates 7. Unnecessary electromagnetic coupling between signal wirings is suppressed. Solder balls 9 connect the signal layer 3 and the signal layer 4 while they function as spacers so that the signal layer 3 and the signal layer 4 are separated by a prescribed interval. Since the transmission line mounting board has a laminated structure of signal layer 3/high dielectric ratio resin layer 10/air layer/high dielectric radio resin layer 11/signal layer 4, a low dielectric ratio layer (air layer) exists between the high dielectric ratio resin layers 10 and 11 even if they are arranged. Consequently, addition of capacity due to the high dielectric ratio resin layers 10 and 11 is prevented. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008227105(A) 申请公布日期 2008.09.25
申请号 JP20070062665 申请日期 2007.03.12
申请人 NEC CORP 发明人 FURUYA MITSURU
分类号 H05K1/14;H01L23/12;H05K1/02 主分类号 H05K1/14
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