| 摘要 |
PROBLEM TO BE SOLVED: To provide a stamping apparatus for winding around a single winding reel a spacer tape and a carrier tape whereon semiconductor chips are stamped. SOLUTION: The stamping apparatus has: a feeding tape 7 around which a carrier tape 1 and a spacer tape 6 are so wound that they overlap with each other; first and second guiding means G1, G2 for so guiding the carrier and spacer tapes drawn out from the feeding reel as to separate them from each other; a metal-mold device 9 for stamping semiconductor chips 2 from the carrier tape guided separately by the guiding means; and a winding reel 25 for winding around it both the carrier tape from which the semiconductor chips have been stamped and the spacer tape guided separately by the guiding means. COPYRIGHT: (C)2008,JPO&INPIT
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