Reduced pressure drying method and device of a substrate

摘要

A reduced pressure drying method and device for a substrate are presented. Firstly, a substrate is placed in a sealed space; then the surface to-be-dried of the substrate is partitioned into a predetermined number of sealed regions; thereafter, the sealed regions are subjected to pressure reduction through gas extraction; finally, the sealed regions are dried through gas insufflation, and then the substrate is taken out from the sealed space. The method can perform reduced pressure drying to various-sized substrates, ensuring uniform pressure and humidity and avoiding formation of reduced pressure drying speckles.

主权项

1. A reduced pressure drying method for a substrate, wherein the method comprises following steps of:
S1: placing the substrate in a sealed space; S2: partitioning the sealed space into at least two sealed regions, on a surface of the substrate to-be-dried; S3: extracting gas from the sealed regions to reduce pressure; S4: blowing and drying the sealed regions, and taking out the substrate from the sealed space.