IC package and method for manufacturing the same

摘要

An IC package is provided. The IC package comprises a leadframe comprising a metal strip (222) partially etched on a first side. The leadframe may be configured for an IC chip to be mounted thereon and for a plurality of bonding areas (218) to be electrically coupled to the leadframe and the IC chip. The IC chip, the bonding areas, and a portion of the metal leadframe are covered with an encapsulation compound, with a plurality of contact pads (206) protruding from the bottom surface of the leadframe. The bottom surface of the leadframe may be etched one or more times during the manufacturing process to reduce the depth of the undercutting. A method for manufacturing an IC package is also provided.

主权项

1. A method of forming an IC package, the method comprising:
providing a metal leadframe formed of a material and having a thickness of a first value; patterning a top surface of the metal leadframe to form recesses therein, the top surface recesses defining upper portions of a plurality of bonding areas; selectively plating the top surface; mounting an IC chip onto the top surface; electrically coupling the IC chip to the plurality of bonding areas; encapsulating the IC chip in an encapsulation compound; after encapsulating, reducing the overall thickness of the metal leadframe from the first value to a second value by removing a layer of the material from an entire bottom surface of the metal leadframe to form a new bottom surface thereon; selectively masking the new bottom surface of the metal leadframe to form a pattern thereon, the pattern defining portions of the metal leadframe to be etched; selectively etching the portions of the metal leadframe to form recesses in the new bottom surface thereof, the bottom surface recesses defining a plurality of contact pads having side walls relative to the new bottom surface of the leadframe with etched undercut therein; and wherein by reducing the overall thickness of the metal leadframe to the second value, the depth of the undercutting is reduced.