Resin composition for a surface treatment, and steel sheet coated with same

摘要

Provided are a resin composition for surface treatment and a surface-treated steel sheet coated therewith. The resin composition for surface treatment includes a dispersing element having excellent thermal conductivity and heat dissipation, thereby maintaining physical properties of the conventional anti-fingerprint steel sheet, for example, high whiteness, fingerprint resistance, workability, electric conductivity and alkali resistance, and providing heat dissipation. In addition, the surface-treated steel sheet coated with the resin composition for surface treatment of the present invention has physical properties such as high heat dissipation, electric conductivity and whiteness, and thus may be replaced with a bottom chassis of a backlight unit, particularly, an edge-type backlight unit.

主权项

1. A resin composition for surface treatment, comprising:
an organic resin at 30 to 60 parts by weight with respect to 100 parts by weight of the resin composition for surface treatment; a thermally conductive dispersing element at 20 to 40 parts by weight with respect to 100 parts by weight of the resin composition for surface treatment; an inorganic metal sol at 5 to 20 parts by weight with respect to 100 parts by weight of the resin composition for surface treatment; a rust inhibitor at 2 to 10 parts by weight with respect to 100 parts by weight of the resin composition for surface treatment; an organic metal complex at 2 to 10 parts by weight with respect to 100 parts by weight of the resin composition for surface treatment; and a crosslinking agent at 2 to 12 parts by weight; with respect to 100 parts by weight of the resin composition for surface treatment, wherein the thermally conductive dispersing element includes, with respect to 100 parts by weight of a solid content of the thermally conductive dispersing element; a silicon-containing compound at 35 to 65 parts by weight; an aluminum-containing compound at 35 to 65 parts by weight; a carbon-containing compound at 10 parts by weight or less; a compound having a far infrared radiation rate of 0.8 or more in a wavelength range of 5 to 20 μm at 10 parts by weight or less; and a dispersion resin at 20 to 80 parts by weight, wherein the silicon-containing compound has an average particle diameter of 5 μm or less, wherein the silicon-containing compound is at least one selected from the group consisting of silicon (Si), silicon carbide (SiC), and silicon nitride (Si3N4), wherein the aluminum-containing compound has an average particle diameter of 3 μm or less, wherein the aluminum-containing compound is at least one selected from the group consisting of aluminum oxide, aluminum nitride (AlN), and an aluminum powder, wherein the carbon-containing compound has an average particle diameter or a length of a major axis of 5 μm or less, wherein the carbon-containing compound is at least one selected from the group consisting of a carbon nanotube, a carbon fiber, a carbon black, a graphite and a graphene, wherein the compound having a far infrared radiation rate of 0.8 or more in a wavelength range of 5 to 20 μm has an average particle diameter of 5 μm or less, wherein the compound having a far infrared radiation rate of 0.8 or more in a wavelength range of 5 to 20 μm is at least one selected from the group consisting of magnesium (Mg), magnesium oxide (MgO), titanium dioxide (TiO2), sericitea, mica, tourmaline, biotite, illite, kaolin, bentonite, quartz porphyry, gneisses, ceramic powder, germanium (Ge), germanium dioxide (GeO2) and germanium 132 (Ge-132), wherein the dispersion resin included in the thermally conductive dispersing element is at least one selected from the group consisting of a waterborne urethane resin, a waterborne acryl resin, a water-soluble epoxy resin, a water-soluble polyester resin, a water-soluble amino resin and a mixture thereof, and wherein the organic resin is at least one selected from the group consisting of a waterborne urethane resin, a waterborne acryl resin, a water-soluble epoxy resin, a water-soluble polyester resin, a water-soluble amino resin and a mixture thereof.